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COLORFUL Brings High-performance iGame Z690D5 Ultra Motherboard

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Colorful Technology Company Limited introduces the iGame Z690D5 Ultra motherboard for the 12th generation Intel Core processors. The motherboard is designed to meet the needs of gamers and content creators for building a high-performance PC with the latest technologies.

The iGame Z690D5 Ultra motherboard sports enlarged and extruded silver wave aluminum heatsinks with a matching white-colored PCB. The motherboard’s headers, DIMM slots, and ICs are in black providing an elegant contrast with the white and silver colors. The motherboard boasts two PCIe 4.0 X16 slots for high-end graphics cards and high-speed AIC NVMe SSDs. The motherboard is also fitted with three M.2 PCIe Gen4x4 slots with high-performance enlarged heatsinks for Gen4 NVMe SSDs.

Extruded Silver Wave Heatsinks

The COLORFUL iGame Z690D5 Ultra motherboard features large extruded silver wave heatsinks to keep the VRM and MOSFETs cool without the need of an active fan. The extrusions create more surface area for heat dissipation making it more efficient for cooling. Furthermore, the silver wave design provides an intricate and eye-catching detail – perfect for gamers and builders that crave for aesthetically pleasing PC builds.

High-Performance PCIe 4.0

The iGame Z690D5 Ultra does not only comes with DDR5 memory support, it also sports two  PCIe 4.0 X16 (X8+X8) slots for high-performance graphics cards and three PCIe 4×4 M.2 slots for high-performance NVMe SSDs.

Pricing and Availability

The COLORFUL iGame Z690D5 Ultra motherboard will be shipping to partner resellers this May of 2022 for $289 MSRP.

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Upgrade Security at Any Premise with Matrix 2MP Turret Series IP Camera

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Matrix Turret Series IP Cameras have been designed for large enterprises. The ball and socket design results in ease while installing the camera. In particular, the axis adjustment becomes easier.

Furthermore, minimum screws used while installing the camera amplifies the IR sensor’s result. Next, the back-illuminated sensors deliver crystal clear images in low-light conditions. Likewise, image enhancing technologies ensure that images are evenly balanced. 

Finally, intelligent video analytics bring out proactive responses and help deter miscreants. Not only the camera stands out in terms of performance but also it is designed using superior components. The camera has the capability to withstand harsh weather conditions due to ingress protection.

KEY FEATURES:

  • Superior Image Clarity – 0.01 Lux
  • Signal-to-Noise Ratio – 73dB
  • Superlative Image Clarity with WDR – 120dB
  • H.265 Video Compression
  • Adaptive Streaming and Smart Streaming
  • Edge Storage: 512GB
  • Motion, Intrusion and Tripwire Detection
  • Ingress Protection (IP67)

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MediaTek Filogic 880 and Filogic 380 Wi-Fi 7 Platform Launched

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MediaTek announced the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth applications in the operator, retail, enterprise and consumer electronics markets. This pair of chips will be among the first Wi-Fi 7 solutions to hit the market, allowing device makers to deliver cutting-edge products with the latest connectivity technology.

Filogic 880 is a complete platform that combines a Wi-Fi 7 access point with a new advanced host processor solution to provide the industry’s best router and gateway solution for operator, retail and enterprise markets. It offers a scalable architecture that can support up to penta-band 4×4 with a maximum speed of 36Gbps. Filogic 380 is designed to bring Wi-Fi 7 connectivity to all client devices, including smartphone, tablet, TVs, notebooks, set-top boxes and OTT streaming devices. The chip’s dual concurrent 2×2 capability will be optimized “out-of-the-box” for these devices as MediaTek also supplies the corresponding platform solutions. This helps to streamline the design process, maximize performance and accelerate time-to-market.

“Our wireless connectivity solutions are designed to deliver the fastest performance using the most advanced technologies, and represent MediaTek’s commitment to drive Wi-Fi 7 adoption in a large number of new markets,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity business at MediaTek. “With Filogic 880 and Filogic 380, our customers can deliver fast, reliable and always-on connected experiences to meet the industry’s growing connectivity demands.”

MediaTek’s Filogic 880 combines a Wi-Fi 7 access point with a powerful application processor and network processing unit (NPU) to support maximum Wi-Fi, Ethernet and packet processing performance. The chip offers a wide range of interfaces and peripherals, making it easy to customize designs for various end products and applications.

The Filogic 880 platform includes a 6nm Wi-Fi 7 access point solution with:

  • Support for key Wi-Fi 7 technologies such as 4096-QAM, 320MHz, MRU and MLO
  • Flexibility to scale to penta-band 36Gbps speeds
  • Support up to 10Gbps in one channel
  • Support for OFDMA RU, MU-MIMO and MBSSID


In addition to its Wi-Fi 7 capabilities, the Filogic 880 platform also provides a powerful host processor, which includes a quad-core Arm Cortex-A73 application processor and an advanced NPU. Key features include:

  • An advanced hardware network full off-load engine on both Wi-Fi and Ethernet interface
  • A built-in networking crypto engine (EIP-197) for accelerating IPSec, SSL/TLS, DTLS (CAPWAP), SRTP and MACsec
  • Support for high-speed interfaces (5Gbps USB and 10Gbps PCI-Express), UART, SD, SPI, PWM, GPIO and OTP for rich platform customization opportunities

The Filogic 380 is a stand-alone, single-chip 6nm Wi-Fi 7 and Bluetooth 5.3 combo solution designed to deliver best-in class connectivity. It is optimized for smartphones, TVs, notebooks, set-top boxes, OTT streaming devices and many other consumer electronics devices that are powered by MediaTek SoCs.

Key features of the Filogic 380 include:

  • Support for key Wi-Fi 7 technologies such as 4096-QAM, 320MHz, MRU and MLO
  • Support for MLO offering up to 6.5Gbps speeds
  • Support up to 5Gbps in one channel
  • Support for 2.4GHz, 5GHz and 6GHz bands
  • Support for dual 2×2 radios for dual-band simultaneous operation
  • Latest Bluetooth 5.3 with LE Audio

MediaTek has been involved in the development of the Wi-Fi 7 standard since its inception, and the company is one of the first adopters of Wi-Fi 7 technology. The rollout of Wi-Fi 7 will mark the first time that Wi-Fi can be a true wireline/Ethernet replacement for super high-bandwidth applications; Wi-Fi 7 technology will be the backbone of home, office and industrial networks and provide seamless connectivity for everything from multi-player AR/VR applications to cloud gaming and 4K calls to 8K streaming and beyond.

MediaTek will be demonstrating its Filogic Wi-Fi 7 platform solutions for both access point and client ecosystems at Computex 2022, which will be held from May 24 to May 27 in Taipei, Taiwan.

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MSI Brings its Latest AMD X670 Motherboards Lineup

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MSI announced that the new MEG X670E GODLIKE, MEG X670E ACE, MPG X670E CARBON WIFI and PRO X670-P WIFI to the brand-new AMD X670 Motherboard product lineup. These new X670 motherboards come with support for the upcoming AMD Ryzen™ 7000 Series processors. We always make sure our goal is to bring every new product as exciting as possible, especially with the new AMD processors and platform. As a world-leading motherboard brand, MSI wants to offer nothing but excitement.  Integrated with the newest technologies and packed full of features, MSI is ready to move into the next generation. Let us introduce you to our brand new X670 motherboards. 

AMD Ryzen 7000 Series processors are the first to use the 5nm FinFET process from TSMC as well as introducing a brand-new platform and socket from AMD. AMD Ryzen 7000 Series processors bring new features like PCIe 5.0, DDR5 Memory support and much more!  The X670 chipset is divided into two segments – X670 Extreme and X670. X670E supports PCIe 5.0 through both the PCIe slot and M.2 slot whereas X670 motherboards support PCIe 5.0 through the M.2 slot exclusively. In addition to PCIe 5.0 and DDR5 support, all MSI X670E & X670 motherboards specification have been upgraded including rear USB Type-C will now support up to Display Port 2.0 output*1. Even more, MEG motherboards’ front USB 3.2 Gen 2×2 Type-C will support 60W Power Delivery.  The VRM design has also been upgraded with up to 24+2 Power Phases with 105A Smart Power Stage. 

Adopted the brand-new ID concept, both Gaming and PRO series motherboards represent its identity. To synchronize the aesthetic look and perfectly match with the different product lines, especially with DIY components, the Product Identity is ready on the X670 motherboard.  X670E Gaming motherboard comes with neat feature designs that further ease your way to enhance your motherboard.  MSI have the exclusive M-Vision Dashboard that allows amazing customization with a touch of a finger to see more detail visual aspect of your motherboard status.  A few new features that come along with our X670E Motherboards are screw-less M.2 Shield Frozr as well as MSI’s patent pending M.2 Shield Frozr with magnetic design to help upgrade or installing M.2 SSD with ease*2.  As well as a smart button in the rear I/O panel for even more customization from entering safe boot, turn on/off all RGB LEDs or activate Turbo Fan. All MSI X670 motherboards will support ARGB Gen2 devices, RGB fanatics will have more options to make their brand-new PC shine even brighter.

Our MEG Series have more features than ever on our MEG X670E GODLIKE and MEG X670E ACE motherboards. The MEG Series adopt E-ATX PCB size and have up to 24+2 VRM phases with 105A Smart Power Stage. They are cooled by a Stacked fin array design heatsink as a well as a heat-pipe to dissipate heat effectively while maintaining at peak performance. There is also a MOSFET baseplate for more heat dissipation for the VRM while the Metal backplate is there to help protect the PCB as well as keeping the rigidity of the board. The MEG Series motherboards are equipped with up to 4 onboard M.2 slots including 1 M.2 PCIe 5.0 x4 slot and a M.2 XPANDER-Z GEN5 DUAL add-on card inside the box for 2 additional PCIe 5.0 x4 M.2 slots for ultimate experience. 

Be Ahead, Pop Your Style – MPG Series

The MPG Series enjoys extraordinary upgrades for the new AMD platform. With the use of carbon black color scheme, MPG X670E CARBON WIFI is steadier than before. This motherboard features 2 PCIe 5.0 x16 slots and 4 M.2 slots that are split into 2 M.2 PCIe 5.0 x4 and 2 PCIe 5.0 x4. It comes with 18+2 VRM power phases with 90A and cooled by Extended heatsink design. Featured the latest specifications, you will definitely be satisfied with a unique aesthetic finish from the Chipset Heatsink to the VRM Heatsink on the MPG X670E CARBON WIFI.

Be Ahead, Pop Your Style – MPG Series

The MPG Series enjoys extraordinary upgrades for the new AMD platform. With the use of carbon black color scheme, MPG X670E CARBON WIFI is steadier than before. This motherboard features 2 PCIe 5.0 x16 slots and 4 M.2 slots that are split into 2 M.2 PCIe 5.0 x4 and 2 PCIe 5.0 x4. It comes with 18+2 VRM power phases with 90A and cooled by Extended heatsink design. Featured the latest specifications, you will definitely be satisfied with a unique aesthetic finish from the Chipset Heatsink to the VRM Heatsink on the MPG X670E CARBON WIFI. 

Business Elegance – PRO Series 

The PRO Series might be the best in popularity for enterprises and creators. With the 14+2 Phases Duet Rail Power System and dual 8-pin CPU power connectors, the PRO X670-P WIFI will tackle any task with ease. The PRO Series does come equipped with 1 M.2 PCIe 5.0 x4 slot, 2.5G LAN and Wi-Fi 6E solution, which can speed through your work with breeze. The linear design matches your office or studio in every possible way for a more unified look.

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